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Use the expressions from the box and complete the following sentences.
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| photolithography power performance capability lightweight useful cores complexity microprocessors layers substrate |
1. Semiconductor devices, as well as passive components, are manufactured on the surface of a thin … of semiconductor material.
2. The rapid adoption of standardized ICs was due to its mass production ….
3. An IC is printed as a unit by ….
4. … is high since the components switch fast and consume little ….
5. SSI circuits were crucial to aerospace projects as they needed … digital computers for their guidance systems.
6. A three-dimensional integrated circuit has two or more … of active electronic components on a single circuit.
7. Microwaves are controlled by ….
8. Integrated circuits have become … for the last 50 years.
9. The term ULSI is used to denote chips of … of more than 1ml transistors.
10. The most advanced are … which control everything.
Complete the table.
| Time period | Scale of integration | Number of transistors per chip |
| 1960s | SSI | a few |
| … | … | hundreds of transistors |
| mid 1970s | … | |
| … | VLSI | … |
| … | … | over a million |
5.6. Answer the questions to the text.
1. What is an IC?
2. What material is the substrate of IC made of?
3. How were transistors assembled earlier?
4. What ensured the rapid adoption of ICs?
5. What are the main advantages of ICs over discrete circuits?
6. Why is the performance of IC high?
7. How many transistors were used in SSI?
8. How is an IC with tens of thousands of transistors per chip called?
9. How are the layers of active components integrated in 3D-ICs?
10.What does modern computing depend on?
Text B
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